IP Library Assignment 041146/0317
Patent Assignment
Reel/Frame 041146/0317

Assignment of Assignor's Interest

Recorded: 2017-02-01 Pages: 7
Assignors
DAUBENSPECK, TIMOTHY H.
Executed: 2017-01-23
GAMBINO, JEFFERY P.
Executed: 2017-01-24
MUZZY, CHRISTOPHER D.
Executed: 2017-01-24
SAUTER, WOLFGANG
Executed: 2017-01-30
SULLIVAN, TIMOTHY D.
Executed: 2017-01-23
Assignee
GLOBALFOUNDRIES INC.
P.O. BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property (1)
Extrusion-Resistant Solder Interconnect Structures and Methods of Forming
Application: 15/421,737 →
Publication: US 2017/0148754
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049709/0871 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →