IP Library › Assignment 041186/0675
Patent Assignment
Reel/Frame 041186/0675

Assignment of Assignor's Interest

Recorded: 2017-02-06 Pages: 3
Assignor
GANDHI, JASPREET S.
Executed: 2014-10-08
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707
Covered Property (1)
Interconnect Structures with Intermetallic Palladium Joints and Associated Systems and Methods
Patent: 9,905,539 →
Application: 15/425,956 →
Publication: US 2017/0148769
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 4 to Patent Security Agreement May 4, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042405/0909 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050702/0451 →