Interconnect structures with intermetallic palladium joints and associated systems and methods
View Patent ↗Interconnect structures with intermetallic palladium joints are disclosed herein. In one embodiment, a method of forming an interconnect structure includes depositing a first conductive material comprising nickel on a first conductive surface of a first die, and depositing a second conductive material comprising nickel on a second conductive surface of a second die spaced apart from the first surface. The method further includes depositing a third conductive material on the second conductive material, and thermally compressing tin/solder between the first and third conductive materials to form an intermetallic palladium joint that extends between the first conductive material and the second conductive material such that one end of the intermetallic palladium joint is bonded directly to the first conductive material and an opposite end of the intermetallic palladium joint is bonded directly to the second conductive material.
1. A method of forming an interconnect structure, comprising:
depositing a first conductive material on a first conductive surface of a first die, wherein the first conductive material comprises nickel;
depositing a second conductive material on a second conductive surface of a second die, wherein the second conductive surface is spaced apart from the first conductive surface, and wherein the second conductive material comprises nickel;
depositing a third conductive material on the second conductive material; and
thermally compressing a bond material comprising tin/solder between the first and third conductive materials to form an intermetallic palladium joint that extends between the first conductive material and the second conductive material such that one end of the intermetallic palladium joint is bonded directly to the first conductive material and an opposite end of the intermetallic palladium joint is bonded directly to the second conductive material.
2. The method of claim 1 wherein depositing the third conductive material comprises forming a first film of palladium having a thickness in a range between about 0.1 μm to 0.3 μm, and wherein the method further comprises forming the bond material on the first conductive material to have a thickness in a range between about 5 μm to 15 μm.
3. The method of claim 1 wherein depositing the third conductive material comprises forming a film of palladium having a thickness in a range between about 0.1 μm to 0.3 μm.
4. The method of claim 1 wherein depositing the third conductive material comprises forming a film of palladium having a thickness in a range between about 0.15 μm to 0.25 μm.
5. The method of claim 1 wherein the method further comprises depositing the bond material on the first conductive material, and wherein the bond material has a thickness in a range between about 5 μm to 15 μm.
6. The method of claim 1 wherein thermally compressing the bond material comprises heating the bond material and moving the first and second conductive materials toward one another while the bond material is heated.
7. The method of claim 1 wherein the intermetallic palladium joint includes a plurality of intermetallic features that extend across the entire bond line thickness, and wherein each of the intermetallic features comprises a portion of the palladium.
8. The method of claim 1 wherein thermally compressing the bond material comprises substantially converting the bond material to intermetallic palladium.
9. The method of claim 1 wherein:
depositing the first conductive material comprises depositing the first conductive material on a conductive pillar of the first die; and
depositing the second conductive material comprises depositing the second conductive material on a bond pad of the second die.
10. A method of forming an interconnect structure, comprising:
forming a first conductive element on a first die;
forming a second conductive element on a second die;
disposing a conductive film on one of the first or second conductive elements, wherein the conductive film includes a surface and a plurality of heterogeneous nucleation sites at the surface;
arranging the first and second dies such that the conductive film is between the first and second conductive elements; and
growing a plurality of intermetallic features at the nucleation sites, wherein individual ones of the intermetallic features form a conductive bond between the first conductive element and the second conductive element.
11. The method of claim 10 wherein the conductive film includes palladium, and wherein each of the intermetallic features comprises a portion of the palladium.
12. The method of claim 10 wherein the conductive film includes a noble metal, and wherein each of the intermetallic features comprises a portion of the noble metal.
13. The method of claim 10 wherein the conductive film comprises palladium, wherein the method further comprises disposing tin between the palladium and the first conductive element; and wherein each of the intermetallic features comprises a portion of the palladium and a portion of the tin.
14. The method of claim 10 wherein the conductive film comprises palladium, and wherein the method further comprises:
disposing solder between the palladium and the first conductive element, wherein the solder comprises tin; and
disposing nickel between the solder and the first conductive element and/or between the palladium and the second conductive element,
wherein each of the intermetallic features comprises a portion of the palladium, a portion of the tin, and a portion of the nickel.
15. The method of claim 10 , further comprising disposing solder between the conductive film and the first conductive element, wherein growing the plurality of intermetallic features includes simultaneously heating the solder and moving the first conductive element and second conductive elements toward one another.
16. A method of manufacturing a semiconductor device, comprising:
depositing a first conductive material on a plurality of first conductive elements of a first semiconductor die;
depositing a second conductive material on a plurality of second conductive elements of a second semiconductor die;
forming a film of conductive material on the second conductive material, wherein the film comprises palladium; and
thermally compressing metal solder between the first conductive material and the second conductive material to form a conductive joint having a plurality of intermetallic features, wherein each of the intermetallic features directly contact the first conductive material and the second conductive material.
17. The method of claim 16 wherein the first and second conductive materials each comprise nickel.
18. The method of claim 16 wherein the metal solder comprises tin/silver, and wherein at least one of the first conductive material and the second conductive material comprises nickel.
19. The method of claim 16 wherein the first and second conductive elements each comprise copper.
20. The method of claim 16 wherein the first conductive elements include conductive pillars, and wherein the second conductive elements include bond pads.