Patent Assignment
Reel/Frame 041203/0308
Assignment of Assignor's Interest
Recorded: 2017-02-08
Pages: 7
Assignors
KIM, JICHUL
Executed: 2016-10-11
KIM, JAE CHOON
Executed: 2016-10-11
RYU, HANSUNG
Executed: 2016-10-11
CHO, KYONGSOON
Executed: 2016-10-11
CHO, YOUNGSANG
Executed: 2016-10-11
YOON, YEO-HOON
Executed: 2016-10-11
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Redistribution Substrate