IP Library › Assignment 041224/0724
Patent Assignment
Reel/Frame 041224/0724

Assignment of Assignor's Interest

Recorded: 2017-02-10 Pages: 8
Assignors
PAEK, JONG SIK
Executed: 2013-04-08
DO, WON CHUL
Executed: 2013-04-09
PARK, DOO HYUN
Executed: 2013-04-12
PARK, EUN HO
Executed: 2013-04-08
OH, SUNG JAE
Executed: 2013-04-08
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Device Having an Encapsulated Front Side and Interposer and Manufacturing Method Thereof
Application: 15/429,591 →
Publication: US 2017/0154861
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →