Patent Assignment
Reel/Frame 041314/0153
Assignment of Assignor's Interest
Recorded: 2017-02-21
Pages: 4
Assignors
HAYATA, SHIGERU
Executed: 2017-01-26
YUZAWA, HIROYA
Executed: 2017-01-27
TOMIYAMA, HIROMI
Executed: 2017-01-26
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Apparatus and Method of Estimating Position of Landing Point of Bonding Tool
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.