Patent Assignment
Reel/Frame 041318/0700
Assignment of Assignor's Interest
Recorded: 2017-02-21
Pages: 3
Assignee
NANYA TECHNOLOGY CORPORATION
NO. 669, FUSING 3RD RD., GUEISHAN DIST.,, TAOYUAN CITY, 333, TAIWAN
Covered Property
(1)
Die Device, Semiconductor Device and Method for Making the Same