Patent Assignment
Reel/Frame 041339/0032
Assignment of Assignor's Interest
Recorded: 2017-02-22
Pages: 4
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 94054
Covered Property
(1)
Embedded Multi-Die Interconnect Bridge with Improved Power Delivery
Application:
15/439,118 →
Publication:
US 2018/0240778
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.