IP Library Assignment 041355/0905
Patent Assignment
Reel/Frame 041355/0905

Assignment of Assignor's Interest

Recorded: 2017-02-23 Pages: 5
Assignors
KIM, EUN SIL
Executed: 2017-02-09
LEE, DOO HWAN
Executed: 2017-02-09
BYUN, DAE JUNG
Executed: 2017-02-09
KO, TAE HO
Executed: 2017-02-09
KIM, YEONG A
Executed: 2017-02-09
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 15/440,181 →
Publication: US 2017/0278766
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →