Patent Assignment
Reel/Frame 041356/0867
Assignment of Assignor's Interest
Recorded: 2017-01-13
Pages: 3
Assignors
KIM, TAE HOON
Executed: 2016-10-18
KIM, JONG HOON
Executed: 2016-10-18
KIM, DAE WON
Executed: 2016-10-18
CHOI, HYEONG SEOK
Executed: 2016-10-19
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Wafer Level Package and Wafer Level Package Manufactured Thereby