Patent Assignment
Reel/Frame 041375/0966
Assignment of Assignor's Interest
Recorded: 2017-02-24
Pages: 14
Assignor
DONGBU HITEK, CO., LTD.
Executed: 2014-10-08
Assignee
INPHI CORPORATION
2953 BUNKER HILL LANE, SUITE 300, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method for Forming Device Isolation Layer of Semiconductor Device
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 14, 2005
From: KWON, YOUNG MIN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016787/0872 →
Change of Name
May 22, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017654/0078 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017654 Frame 0078. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 22, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017829/0911 →
Assignment of Assignor's Interest
Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment.
Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest
Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest
Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest
Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →