Patent Assignment
Reel/Frame 041384/0387
Assignment of Assignor's Interest
Recorded: 2017-02-27
Pages: 6
Assignors
LI, XUAN
Executed: 2015-10-09
KATKAR, RAJESH
Executed: 2015-10-06
HUYNH, LONG
Executed: 2015-10-20
MIRKARIMI, LAURA WILLS
Executed: 2015-10-23
LEE, BONGSUB
Executed: 2015-10-06
GUEVARA, GABRIEL Z.
Executed: 2015-10-21
VU, TU TAM
Executed: 2015-10-20
BANG, KYONG-MO
Executed: 2015-10-20
AGRAWAL, AKASH
Executed: 2015-10-21
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0668 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0751 →