IP Library Assignment 041385/0630
Patent Assignment
Reel/Frame 041385/0630

Assignment of Assignor's Interest

Recorded: 2017-02-27 Pages: 5
Assignors
QUON, ROGER A.
Executed: 2017-02-27
RIZZOLO, MICHAEL
Executed: 2017-02-17
YANG, CHIH-CHAO
Executed: 2017-02-17
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Modulating the Microstructure of Metallic Interconnect Structures
Application: 15/443,583 →
Publication: US 2018/0247866
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 13, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052644/0868 →