Patent Assignment
Reel/Frame 041399/0912
Assignment of Assignor's Interest
Recorded: 2017-02-28
Pages: 3
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property
(1)
Laminate For Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Method Of Manufacturing Electronic Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.