Patent Assignment
Reel/Frame 041453/0372
Assignment of Assignor's Interest
Recorded: 2017-03-03
Pages: 3
Assignors
CHEN, CHIEN-CHUNG
Executed: 2016-12-30
MAO, SEN
Executed: 2016-12-30
LIN, HSIN-LIANG
Executed: 2016-12-30
Assignee
TAIWAN SEMICONDUCTOR CO., LTD.
11F., NO.205, SEC. 3, BEIXIN RD., XINDIAN DIST., NEW TAIPEI CITY, 231, TAIWAN
Covered Property
(1)
Integrated Packaging Structure