Patent Assignment
Reel/Frame 041462/0980
Assignment of Assignor's Interest
Recorded: 2017-03-03
Pages: 6
Assignors
JUN, HWI CHAN
Executed: 2017-03-02
KIM, CHANG HWA
Executed: 2017-03-02
HA, DAE WON
Executed: 2017-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Contact Structure