Patent Assignment
Reel/Frame 041481/0201
Assignment of Assignor's Interest
Recorded: 2017-03-07
Pages: 2
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Film, Rib Pattern Formation Method, Hollow Structure and Formation Method for Same, and Electronic Component
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Mar 7, 2017
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 041900/0896 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →