Patent Assignment
Reel/Frame 041516/0202
Assignment of Assignor's Interest
Recorded: 2017-03-09
Pages: 10
Assignors
LEE, DOHYUN
Executed: 2017-02-22
PARK, YOUNGWOO
Executed: 2017-02-27
PARK, JUNGHOON
Executed: 2017-02-22
LEE, JAEDUK
Executed: 2017-02-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Interconnection Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.