Patent Assignment
Reel/Frame 041538/0922
Assignment of Assignor's Interest
Recorded: 2017-03-10
Pages: 6
Assignors
YUN, JOO-SUNG
Executed: 2016-12-06
CHOI, WOON-SUP
Executed: 2016-12-06
LEE, MOON-HO
Executed: 2016-12-06
SHIN, SEONG-SEOB
Executed: 2016-12-06
Assignee
SAMSUNG ELECTRIC CORPORATION
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Test Board for Semiconductor Package, Test System, and Method of Manufacturing Semiconductor Package