Test board for semiconductor package, test system, and method of manufacturing semiconductor package
A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.
1. A test board comprising:
a board substrate;
a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package;
a test controller;
a wireless signal unit configured to wirelessly exchange signals with a server; and
a single wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket,
wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.
2. The test board of claim 1 , wherein the test controller is attached to a first surface of the board substrate.
3. The test board of claim 1 , wherein the wireless signal unit comprises a wireless signal transceiver that is attached to a first surface of the board substrate, and
wherein the single wireless power unit comprises:
a power receiver attached to a second surface opposite to the first surface of the board substrate; and
a power storage and supply unit configure to store and to supply the electric power received by the power receiver from the external source.
4. The test board of claim 1 , wherein the test controller comprises:
a hardware processor;
a transceiver configured to communicate with the semiconductor package to be tested; and
an algorithmic pattern generator configured to convert the test pattern command to a signal to be applied to the semiconductor package.
5. The test board of claim 1 , wherein the test controller comprises a Field Programmable Gate Array (FPGA).
6. The test board of claim 1 , wherein the single wireless power unit is configured to supply electric power to the wireless signal unit.
7. A test system comprising:
a server; and
a plurality of test boards configured to wirelessly exchange signals with the server,
wherein each of the plurality of test boards comprises:
a single device under test (DUT) socket configured to accommodate a semiconductor package and configured to accommodate a single DUT, the single DUT attached on each of the plurality of test boards;
a test controller configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server; and
a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket.
8. The test system of claim 7 , wherein each of the plurality of test boards is configured to independently and simultaneously perform the test on the semiconductor package accommodated in the single DUT socket.
9. The test system of claim 7 , wherein the wireless power unit comprises:
a power receiver; and
a power storage and supply unit configured to store and to supply the electric power that the power receiver wirelessly received from the external source.
10. The test system of claim 9 , wherein the external source comprises a power supply unit configured to wirelessly supply the electric power to the wireless power unit of each of the plurality of test boards.
11. The test system of claim 10 , wherein the power supply unit is configured to wirelessly supply the electric power to the wireless power unit of each of the plurality of test boards while each of the plurality of test boards performs a test.
12. The test system of claim 10 , wherein, before the semiconductor package is accommodated in the single DUT socket of each of the plurality of test boards, the power supply unit is configured to wirelessly supply the electric power to the wireless power unit of each of the plurality of test boards to charge the power storage and supply unit.
13. The test system of claim 10 , further comprising a wireless signal unit configured to wirelessly exchange signals with the server,
wherein the wireless signal unit comprises a wireless signal transceiver attached to a first surface of a board substrate of the test board, and
wherein the power receiver is attached to a second surface opposite to the first surface of the board substrate.
14. The test system of claim 13 , wherein the power storage and supply unit comprises a secondary battery, and
wherein the secondary battery of the power storage and supply unit is attached to the second surface of the board substrate.
15. The test system of claim 13 , wherein the power storage and supply unit comprises a secondary battery, and
wherein the secondary battery of the power storage and supply unit is attached to the first surface of the board substrate.
16. A test system comprising:
a test board comprising:
a board substrate;
a wireless signal transceiver and a power storage and supply unit provided on a first side of the board substrate; and
a power receiver provided on a second side opposite of the first side of the board substrate; and
a power supply unit configured to charge the power storage and supply unit provided on the test board and comprising:
a power generator; and
a power transmitter,
wherein the test board is provided on the power transmitter.
17. The test system of claim 7 further comprises a connector attached to a side surface of a board substrate of the test board,
wherein the single DUT socket is connected to the connector.
18. The test system of claim 7 , wherein each of the plurality of test boards further comprises a memory configured to store the test pattern command being wirelessly received from the server and a result of the test performed by the test controller.
19. The test system of claim 7 , further comprising a device attachment/detachment apparatus configured to attach or detach the semiconductor package to be tested to or from the single DUT socket of each of the plurality of test boards.
20. The test system of claim 16 , wherein the power transmitter comprises:
a first power transmitter; and
a second power transmitter,
wherein the test board comprises:
a first test board; and
a second test board,
wherein the first test board is provided on the first power transmitter and the second test board is provided on the second power transmitter, and
wherein the first power transmitter is stacked on the second power transmitter with an interval therebetween.
21. The test system of claim 20 , wherein the interval between the first and second power transmitters is greater than a thickness of the test board.
22. The test system of claim 16 , wherein the power supply unit is configured to wirelessly charge the power storage and supply unit.