Patent Assignment
Reel/Frame 041541/0133
Assignment of Assignor's Interest
Recorded: 2017-03-10
Pages: 12
Assignors
BANDYOPADHYAY, SUDIP
Executed: 2017-03-09
CHOW, KEEN WAH
Executed: 2017-03-09
DATTA, DEVESH KUMAR
Executed: 2017-03-10
JINDAL, ANURAG
Executed: 2017-03-10
ECONOMY, DAVID ROSS
Executed: 2017-03-07
MELDRIM, JOHN MARK
Executed: 2017-03-07
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property
(1)
Conductive Components and Memory Assemblies
Patent:
9,773,807 →
Application:
15/455,859 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 4 to Patent Security Agreement
May 4, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042405/0909 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050702/0451 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →