Patent Assignment
Reel/Frame 041573/0029
Assignment of Assignor's Interest
Recorded: 2017-03-14
Pages: 7
Assignors
YANG, DEOKKYUNG
Executed: 2017-03-13
KIM, YONGMIN
Executed: 2017-03-13
CHOI, JAEHYUK
Executed: 2017-03-13
KO, YEOCHAN
Executed: 2017-03-13
LEE, HEESOO
Executed: 2017-03-13
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
System -in-Package with Double-Sided Molding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.