Patent Assignment
Reel/Frame 041586/0687
Assignment of Assignor's Interest
Recorded: 2017-03-15
Pages: 2
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Method of Forming a Packaged Semiconductor Device Using Ganged Conductive Connective Assembly and Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.