Patent Assignment
Reel/Frame 041707/0224
Assignment of Assignor's Interest
Recorded: 2017-03-23
Pages: 11
Assignors
CHIU, CHIA-PIN
Executed: 2013-08-15
MA, QING
Executed: 2013-08-16
SANKMAN, ROBERT L.
Executed: 2013-09-13
FISCHER, PAUL B.
Executed: 2013-09-09
MORROW, PATRICK
Executed: 2013-10-30
LAMBERT, WILLIAM J.
Executed: 2013-09-20
GEALER, CHARLES A.
Executed: 2013-09-20
OSBORN, TYLER
Executed: 2013-09-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die Assembly on Thin Dielectric Sheet
Application:
14/886,452 →
Publication:
US 2016/0043056
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.