DIE ASSEMBLY ON THIN DIELECTRIC SHEET
A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet is over the interconnect areas of the first and the second die. Conductive vias in the dielectric sheet connect with pads of the interconnect areas. A build-up layer over the dielectric sheet includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias. The dies are mounted to a package substrate through the build-up layers, and a package cover is over the dies, the dielectric sheet, and the build-up layer.
1 . An apparatus comprising:
a first and a second die, each having interconnect areas;
a dielectric sheet over the interconnect areas of the first and the second die;
conductive vias in the dielectric sheet to connect with pads of the interconnect areas;
a build-up layer over the dielectric sheet including routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias;
a package substrate, wherein the dies are mounted to the package substrate through the build-up layers; and
a package cover over the dies, the dielectric sheet, and the build-up layer.
2 . The apparatus of claim 1 , wherein the conductive vias are copper filled.
3 . The apparatus of claim 1 , wherein the package cover is a molding compound.
4 . The apparatus of claim 1 , wherein the package substrate is coupled to the build-up layer and to the package cover.
5 . The apparatus of claim 4 , further comprising underfill between the build-up layer and the package substrate.
6 . The apparatus of claim 1 , wherein the dielectric sheet has a polished surface facing the dies and is stable to 600° C.
7 . The apparatus of claim 1 , wherein the dielectric sheet is a glass sheet attached to the first and the second die with an adhesive.
8 . The apparatus of claim 1 , wherein the dielectric sheet is attached to the first and the second die with a directly bonded oxide.
9 . The apparatus of claim 1 , wherein the interconnect areas are on the front sides of the dies, wherein the dielectric sheet is over the front sides of the dies, and wherein the front sides of the dies are facing the package substrate.
10 . The apparatus of claim 1 , wherein the first and second die are connected together in part through the build-up layer without connecting through the package substrate.
11 . A computer system comprising:
a display;
a user interface; and
a processor package having:
a first and a second die, each having interconnect areas;
a dielectric sheet over the interconnect areas of the first and the second die;
conductive vias in the dielectric sheet to connect with pads of the interconnect areas;
a build-up layer over the dielectric sheet including routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias;
a package substrate, wherein the dies are mounted to the package substrate through the build-up layers; and
a package cover over the dies, the dielectric sheet, and the build-up layer.
12 . The computer system of claim 11 , wherein the dielectric sheet is made from glass.
13 . The computer system of claim 12 , wherein the conductive vias are laser drilled holes filled with copper.
14 . The apparatus of claim 11 , wherein the package cover is a molding compound.
15 . The apparatus of claim 14 , wherein the package substrate is coupled to the build-up layer and to the package cover.
17 . The apparatus of claim 11 , wherein the dielectric sheet is a glass sheet with a polished surface facing the dies and is stable to 600° C.
18 . The apparatus of claim 17 , wherein the glass sheet is attached to the first and the second die with an adhesive.
19 . The apparatus of claim 11 , wherein the interconnect areas are on the front sides of the dies, wherein the dielectric sheet is over the front sides of the dies, and wherein the front sides of the dies are facing the package substrate.
20 . The apparatus of claim 11 , wherein the first and second die are connected together in part through the build-up layer without connecting through the package substrate.