Patent Assignment
Reel/Frame 041735/0462
Assignment of Assignor's Interest
Recorded: 2017-02-15
Pages: 5
Assignors
LEWIS, RYAN J.
Executed: 2015-12-07
LEE, YUNG-CHENG
Executed: 2015-12-07
LIEW, LI-ANNE
Executed: 2015-12-07
WANG, YUNDA
Executed: 2015-12-07
Assignee
KELVIN THERMAL TECHNOLOGIES, INC
5429 ILLINI WAY, BOULDER, COLORADO, 80303
Covered Property
(1)
Polymer-Based Microfabricated Thermal Ground Plane
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.