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Patent Assignment
Reel/Frame 046566/0415

Assignment of Assignor's Interest

Recorded: 2018-08-07 Pages: 7
Assignors
LEWIS, RYAN JOHN
Executed: 2018-06-05
LIEW, LI-ANNE
Executed: 2018-05-17
LEE, YUNG-CHENG
Executed: 2018-04-11
WANG, YUNDA
Executed: 2018-05-08
Assignee
THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
1800 GRANT STREET, 8TH FLOOR, DENVER, COLORADO, 80203
Covered Property (1)
Polymer-Based Microfabricated Thermal Ground Plane
Patent: 9,921,004 →
Application: 14/925,787 →
Publication: US 2016/0161193
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 15, 2017
From: LEWIS, RYAN J.; LEE, YUNG-CHENG; LIEW, LI-ANNE; WANG, YUNDA
To: KELVIN THERMAL TECHNOLOGIES, INC
Reel/Frame 041735/0462 →