Patent Assignment
Reel/Frame 041748/0023
Assignment of Assignor's Interest
Recorded: 2017-03-27
Pages: 4
Assignors
TSENG, HSIN-HSIANG
Executed: 2017-03-22
LEE, CHIH-FEI
Executed: 2017-03-22
CHENG, CHIA-PIN
Executed: 2017-03-22
CHANG, FU-CHENG
Executed: 2017-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device with Nanostructures and Methods of Forming the Same