IP Library Assignment 041751/0961
Patent Assignment
Reel/Frame 041751/0961

Assignment of Assignor's Interest

Recorded: 2017-03-27 Pages: 8
Assignors
MORIYA, ATSUSHI
Executed: 2015-10-29
NAKAISO, NAOHARU
Executed: 2015-10-29
ORIHASHI, YUGO
Executed: 2015-10-29
MURAKAMI, KOTARO
Executed: 2015-10-29
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME,, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property (1)
Method of Forming Silicon Layer in Manufacturing Semiconductor Device and Recording Medium
Patent: 9,941,119 →
Application: 15/468,966 →
Publication: US 2017/0213727
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →