Patent Assignment
Reel/Frame 041771/0774
Assignment of Assignor's Interest
Recorded: 2017-03-28
Pages: 6
Assignors
MAENOSONO, TOSHIYUKI
Executed: 2017-03-13
KIKUCHI, YUTA
Executed: 2017-03-09
ITO, MANABU
Executed: 2017-03-10
SAEKI, YOSHIHIRO
Executed: 2017-03-27
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716
Covered Property
(1)
Method of Forming Vias Using Silicon on Insulator Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 4 to Patent Security Agreement
May 4, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042405/0909 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050702/0451 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →