Patent Assignment
Reel/Frame 041789/0039
Assignment of Assignor's Interest
Recorded: 2017-03-29
Pages: 3
Assignor
HAPPOYA, AKIHIKO
Executed: 2017-03-17
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Semiconductor Device That Includes a Molecular Bonding Layer for Bonding of Elements