Patent Assignment
Reel/Frame 041789/0420
Assignment of Assignor's Interest
Recorded: 2017-03-29
Pages: 6
Assignors
BOGEN, INGO
Executed: 2016-11-25
BRAML, HEIKO
Executed: 2016-11-28
GÖBL, CHRISTIAN
Executed: 2016-11-28
SAGEBAUM, ULRICH
Executed: 2016-11-28
WINDISCHMANN, JÜRGEN
Executed: 2017-02-08
Assignee
SEMIKRON ELEKTRONIK GMBH & CO., KG
SIGMUNDSTRASSE 200, NÜRNBERG, 90431, GERMANY
Covered Property
(1)
Apparatus for the Material-Bonded Connection of Connection Partners of a Power-Electronics Component