Apparatus for the material-bonded connection of connection partners of a power-electronics component
A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.
1. Apparatus for the material-bonded connection of connection partners of a power-electronics component, the apparatus comprising:
a pressing ram having an elastic cushion element, for the material-bonded press-sintering connection of a first connection partner to a second connection partner of the power-electronics component, said pressing ram also having a guide part and guide holes;
a dimensionally stable frame which encloses said elastic cushion element;
a suspension arrangement positioned between said pressing ram and said frame; and
guide-column elements which project away from said frame and extend in a movably guided manner through said guide holes of said pressing ram;
wherein said elastic cushion element and said guide part of said pressing ram are guided for linear movement within said frame such that said frame lowers onto said first connection partner, and, following abutment against the same, said pressing ram together with said elastic cushion element is lowered onto said second connection partner;
whereby said elastic cushion element exerts the pressure necessary for connecting said first connection partner to said second connection partner.
2. The apparatus of claim 1 , wherein said pressing ram further includes a lowering device which acts independently of said frame.
3. The apparatus of claim 1 , wherein said pressing ram has an inactive state in which an end surface of said elastic cushion element is set back slightly in relation to a bearing end periphery of said frame for bearing on said first connection partner.
4. The apparatus of claim 3 , wherein said bearing end periphery of said frame is generally smooth, and defines a generally planar bearing surface.
5. The apparatus of claim 1 , further comprising:
means for heating said pressing ram.
6. The apparatus of claim 1 , further comprising:
a mating ram element positioned so that at least a portion of the power-electronics component is arranged between said pressing ram and said mating ram element.
7. The apparatus of claim 6 , further comprising:
means for heating said mating ram element.
8. Apparatus for the material-bonded connection of connection partners of a power-electronics component, the apparatus comprising:
a pressing ram having an elastic cushion element, for the material-bonded press-sintering connection of a first connection partner to a second connection partner of the power-electronics component, said pressing ram also having a guide part;
a dimensionally stable frame which encloses said elastic cushion element; and
a suspension arrangement positioned between said pressing ram and said frame;
wherein said elastic cushion element and said guide part of said pressing ram are guided for linear movement within said frame such that said frame lowers onto said first connection partner, and, following abutment against the same, said pressing ram together with said elastic cushion element is lowered onto said second connection partner;
whereby said elastic cushion element exerts the pressure necessary for connecting said first connection partner to said second connection partner;
wherein said elastic cushion element consists of silicone and has a Shore A hardness of between about 25 and about 100; and
wherein said silicone is stabilized by metallic additives and can thus be used at temperatures of more than about 175° C. and pressures between about 10 and about 40 MPa.
9. The apparatus of claim 8 , wherein said silicone has a Shore A hardness of between about 50 and about 75.
10. The apparatus of claim 8 , wherein said metallic additives include one of iron and iron compounds.
11. The apparatus of claim 10 , wherein said metallic additives include iron oxide, and thus said silicone can be used at temperatures of more than about 210° C.
12. The apparatus of claim 1 , further comprising:
a non-adhering plastic film with a thickness between about 25 μm and about 200 μm, arranged between said cushion element and the power-electronics component during the pressing operation.
13. The apparatus of claim 12 , wherein said non-adhering plastic film is a PTFE film.
14. The apparatus of claim 12 , wherein said thickness of said non-adhering plastic film, is between about 50 μm and about 100 μm.
15. The apparatus of claim 6 , wherein the portion of the power-electronics component which is arranged between said pressing ram and said mating ram element is at least one of said first and second connection partners.
16. The apparatus of claim 1 , wherein said elastic cushion element consists of silicone and has a Shore A hardness of between about 25 and about 100.
17. The apparatus of claim 16 , wherein said silicone has a Shore A hardness of between about 50 and about 75.