Patent Assignment
Reel/Frame 041802/0586
Assignment of Assignor's Interest
Recorded: 2017-03-30
Pages: 7
Assignors
ENG, MEOW KOON
Executed: 2007-08-28
POO, CHIA YONG
Executed: 2007-08-28
JEUNG, BOON SUAN
Executed: 2007-08-28
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707
Covered Property
(1)
Microelectronic Die Packages with Metal Leads, Including Metal Leads for Stacked Die Packages, and Associated Systems and Methods
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 4 to Patent Security Agreement
May 4, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042405/0909 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050702/0451 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →