Patent Assignment
Reel/Frame 041803/0754
Assignment of Assignor's Interest
Recorded: 2017-03-31
Pages: 3
Assignors
PARK, JI YONG
Executed: 2017-03-06
CHAVALI, SRI CHAITRA J
Executed: 2017-03-13
ALUR, SIDDHARTH K
Executed: 2017-03-14
LEE, KYU OH
Executed: 2017-03-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.