IP Library › Assignment 076063/0964
Patent Assignment
Reel/Frame 076063/0964

Assignment of Assignor's Interest

Recorded: 2026-09-18 Pages: 4
Assignor
INTEL CORPORATION
Executed: 2026-04-10
Assignee
INTEL FOUNDRY IP LLC
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (14)
Semiconductor devices and methods for forming semiconductor devices
Application: 16/019,585 →
Publication: US US20200006483A1
Integrated circuits and methods for forming integrated circuits
Application: 16/221,815 →
Publication: US US20200194338A1
Integrated Circuits and Methods for Forming Integrated Circuits
Application: 17/303,270 →
Publication: US US20210351105A1
Integrated Circuits and Methods for Forming Thin Film Crystal Layers
Application: 17/648,821 →
Publication: US US20220148917A1
Semiconductor Structure and Method for Forming a Semiconductor Structure
Application: 17/644,801 →
Publication: US US20230197537A1
Semiconductor Devices and Methods for Forming a Semiconductor Device
Application: 17/448,714 →
Publication: US US20230095162A1
Semiconductor Dies and Devices with Frontside and Backside Coils for Inductive Coupling
Application: 17/448,738 →
Publication: US US20230101378A1
Semiconductor Dies and Devices with a Coil for Inductive Coupling
Application: 17/448,734 →
Publication: US US20230102133A1
Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate
Application: 15/475,157 →
Publication: US US20180281374A1
Semiconductor Package, and a Method for Forming a Semiconductor Package
Application: 15/638,527 →
Publication: US US20190006293A1
Semiconductor Packages, and Methods for Forming Semiconductor Packages
Application: 16/641,241 →
Publication: US US20200227388A1
Stacked Fan-Out Semiconductor Chip
Patent: 8,878,360 →
Application: 13/548,705 →
Publication: US US20140015131A1
System-in-Package Devices and Methods for Forming System-in-Package Devices
Application: 15/776,475 →
Publication: US US20180331080A1
Electrical Devices and Methods for Forming Electrical Devices
Application: 16/079,105 →
Publication: US US20190074252A1
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2012
From: MEYER, THORSTEN; OFNER, GERALD; ALBERS, SVEN
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 028583/0528 →
Change of Name Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest Mar 31, 2017
From: PARK, JI YONG; CHAVALI, SRI CHAITRA J; ALUR, SIDDHARTH K; LEE, KYU OH
To: INTEL CORPORATION
Reel/Frame 041803/0754 →
Assignment of Assignor's Interest Jun 30, 2017
From: BEATTY, JOHN J; PRSTIC, SUZANA; MEHTA, VIPUL V
To: INTEL CORPORATION
Reel/Frame 043070/0943 →
Assignment of Assignor's Interest May 24, 2018
From: GEISSLER, CHRISTIAN; ALBERS, SVEN; SEIDEMANN, GEORG; WOLTER, ANDREAS
To: INTEL IP CORPORATION
Reel/Frame 045891/0334 →
Assignment of Assignor's Interest Jun 28, 2018
From: JOVANOV, VASE; BAUMGARTNER, PETER; BRACHER, GREGOR; GILES, LUIS
To: INTEL IP CORPORATION
Reel/Frame 046223/0317 →
Assignment of Assignor's Interest Aug 23, 2018
From: CHIGULLAPALLI, SRUTI; FITCH, LESLIE; WU, BOPING
To: INTEL CORPORATION
Reel/Frame 046673/0792 →
Assignment of Assignor's Interest Mar 5, 2019
From: NAYLOR, CARL; AGRAWAL, ASHISH; LIN, KEVIN; SHARMA, ABHISHEK
To: INTEL CORPORATION
Reel/Frame 048501/0249 →
Assignment of Assignor's Interest Mar 10, 2020
From: WAIDHAS, BERND; SEIDEMANN, GEORG; WAGNER, THOMAS; WOLTER, ANDREAS
To: INTEL IP CORPORATION
Reel/Frame 052060/0913 →
Assignment of Assignor's Interest Jun 8, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 056524/0373 →
Assignment of Assignor's Interest Jun 9, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 056676/0600 →
Assignment of Assignor's Interest Jun 9, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 057254/0415 →
Assignment of Assignor's Interest Aug 2, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 057060/0431 →
Assignment of Assignor's Interest Sep 24, 2021
From: SEIDEMANN, GEORG; LUTZ, WALTHER; OSTERMAYR, MARTIN; ASSENMACHER, JOACHIM
To: INTEL CORPORATION
Reel/Frame 057588/0569 →
Assignment of Assignor's Interest Sep 27, 2021
From: SEIDEMANN, GEORG; OSTERMAYR, MARTIN; LUTZ, WALTHER; ASSENMACHER, JOACHIM
To: INTEL CORPORATION
Reel/Frame 057601/0550 →
Assignment of Assignor's Interest Nov 23, 2021
From: BAUMGARTNER, PETER; ASSENMACHER, JOACHIM; LUTZ, WALTHER; OSTERMAYR, MARTIN
To: INTEL CORPORATION
Reel/Frame 058193/0797 →
Assignment of Assignor's Interest Dec 17, 2021
From: GEIGER, RICHARD; HEROLD, KLAUS; GOSSNER, HARALD; OSTERMAYR, MARTIN
To: INTEL CORPORATION
Reel/Frame 058412/0074 →
Assignment of Assignor's Interest Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →
Assignment of Assignor's Interest Jul 28, 2023
From: NAYLOR, CARL; AGRAWAL, ASHISH; LIN, KEVIN; SHARMA, ABHISHEK
To: INTEL CORPORATION
Reel/Frame 064413/0363 →
Assignment of Assignor's Interest Oct 25, 2024
From: NAYLOR, CARL; AGRAWAL, ASHISH; LIN, KEVIN; SHARMA, ABHISHEK
To: INTEL CORPORATION
Reel/Frame 069016/0363 →