Patent Assignment
Reel/Frame 041819/0457
Assignment of Assignor's Interest
Recorded: 2017-04-01
Pages: 3
Assignor
DONG, HAOXIANG
Executed: 2017-02-24
Assignee
SHENZHEN HUIDING TECHNOLOGY CO., LTD.
FLOOR 13, PHASE B, TENGFEI INDUSTRIAL BUILDING, FUTIAN FREE TRADE ZONE, SHENZHEN, 518000, CHINA
Covered Property
(1)
Package Structure, Electronic Device and Method for Manufacturing Package Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.