Package structure, electronic device and method for manufacturing package structure
A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate ( 100 ), a sensing module ( 200 ) disposed on an upper surface of the substrate ( 100 ) and electrically connected to the substrate ( 100 ), and a package colloid ( 300 ) disposed on the upper surface of the substrate ( 100 ) and coating at least one portion of the sensing module ( 200 ), wherein the sensing module ( 200 ) comprises a capacitive sensor ( 210 ) and an optical sensor ( 220 ), and the package colloid ( 300 ) comprises at least one portion of a photic zone ( 310 ) disposed corresponding to the optical sensor ( 220 ). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.
1. A package structure, comprising:
a substrate;
a sensing module disposed on an upper surface of the substrate and electrically connected to the substrate; and
a package colloid disposed on the upper surface of the substrate and coating at least one portion of the sensing module,
wherein the sensing module comprises a capacitive sensor and an optical sensor, and
the package colloid comprises at least one portion of a photic zone disposed corresponding to the optical sensor.
2. The package structure according to claim 1 , wherein the photic zone is made of a transparent material.
3. The package structure according to claim 1 , wherein the package colloid is made of a transparent material.
4. The package structure according to claim 1 , further comprising an LED module disposed on the upper surface of the substrate.
5. An electronic device, comprising a package structure, wherein the package structure comprises:
a substrate;
a sensing module disposed on an upper surface of the substrate and electrically connected to the substrate; and
a package colloid disposed on the upper surface of the substrate and coating at least one portion of the sensing module,
wherein the sensing module comprises a capacitive sensor and an optical sensor, and
the package colloid comprises at least one portion of a photic zone disposed corresponding to the optical sensor.
6. A method for manufacturing a package module, comprising:
disposing a sensing module on an upper surface of a substrate, to electrically connected to the substrate, wherein the sensing module comprises a capacitive sensor and an optical sensor; and
disposing a package colloid on the upper surface of the substrate, coating at least one portion of the sensing module, wherein the disposed package colloid comprises a photic zone and at least one portion of the photic zone is disposed corresponding to the optical sensor.
7. The method according to claim 6 , wherein in step of disposing a package colloid on the upper surface of the substrate, the package colloid is integrally formed on the upper surface of the substrate and made of a transparent material.
8. The method according to claim 7 , wherein the step of disposing a package colloid on the upper surface of the substrate further comprises, after disposing the photic zone, disposing an opaque package colloid on a zone of the upper surface of the substrate other than the photic zone via an Exposed Die Molding process.
9. The method according to claim 7 , wherein the step of disposing a package colloid on the upper surface of the substrate further comprises, after disposing the photic zone,
disposing an opaque package colloid on the upper surface of the substrate via a plastic package process, to coat the sensing module;
polishing a surface of the opaque package colloid to expose the photic zone.
10. The method according to claim 6 , wherein in step of disposing a package colloid on the upper surface of the substrate, the photic zone is disposed by any one way of stencil printing, spin-coating, photoetching, special-shaped mold molding, dispensing and patching.
11. The method according to claim 6 , further comprises:
before disposing the sensing module, disposing an LED module on the upper surface of the substrate.