Patent Assignment
Reel/Frame 041839/0839
Assignment of Assignor's Interest
Recorded: 2017-04-04
Pages: 3
Assignors
VANAGAS, EGIDIJUS
Executed: 2017-03-07
KIMBARAS, DZIUGAS
Executed: 2017-03-03
VESELIS, LAURYNAS
Executed: 2017-03-08
Assignee
EVANA TECHNOLOGIES, UAB
J. GALVYDZIO G. 3, VILNIUS, 08236, LITHUANIA
Covered Property
(1)
Method of Laser Processing for Substrate Cleaving or Dicing Through Forming "Spike-Like" Shaped Damage Structures
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.