IP Library › Assignment 070781/0409
Patent Assignment
Reel/Frame 070781/0409

Merger

Recorded: 2025-04-09 Pages: 4
Assignor
EVANA TECHNOLOGIES, UAB
Executed: 2023-12-07
Assignee
LIGHT CONVERSION, UAB
KERAMIKU 2B, VILNIUS, LITHUANIA
Covered Properties (3)
Method of Laser Processing for Substrate Cleaving or Dicing Through Forming "Spike-Like" Shaped Damage Structures
Application: 15/512,189 →
Publication: US 2017/0250113
Method of Laser Scribing of Semiconductor Workpiece Using Divided Laser Beams
Application: 15/573,358 →
Publication: US 2019/0139799
Multi-Segment Focusing Lens and the Laser Processing for Wafer Dicing or Cutting
Application: 16/309,992 →
Publication: US 2019/0217420
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 4, 2017
From: VANAGAS, EGIDIJUS; KIMBARAS, DZIUGAS; VESELIS, LAURYNAS
To: EVANA TECHNOLOGIES, UAB
Reel/Frame 041839/0839 →
Assignment of Assignor's Interest Nov 14, 2017
From: VANAGAS, EGIDIJUS; KIMBARAS, DZIUGAS; VESELIS, LAURYNAS
To: EVANA TECHNOLOGIES, UAB
Reel/Frame 044120/0027 →
Assignment of Assignor's Interest Jan 15, 2019
From: VANAGAS, EGIDIJUS; KIMBARAS, DZIUGAS; BAZILEVICIUS, KAROLIS ZILVINAS
To: EVANA TECHNOLOGIES, UAB
Reel/Frame 048076/0652 →