Patent Assignment
Reel/Frame 041841/0196
Assignment of Assignor's Interest
Recorded: 2017-04-04
Pages: 4
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.