Patent Assignment
Reel/Frame 041851/0598
Assignment of Assignor's Interest
Recorded: 2017-04-05
Pages: 3
Assignor
HAN, TAI-SHENG
Executed: 2016-12-09
Assignee
EVGA CORPORATION
10F., NO. 2, BAOSHENG RD., YONGHE DIST., NEW TAIPEI CITY, TAIWAN
Covered Property
(1)
Interlaced Heat Dissipation Structure of Addin Card