IP Library › Granted Patent US 10,278,308
Granted Patent B2
US 10,278,308 · App. 15/475,159 · Granted Apr 30, 2019

Interlaced heat dissipation structure of addin card

Inventor: Tai-Sheng Han (New Taipei, TW)
Assignee: EVGA CORPORATION
H05K7/20409G06F1/20H05K7/20172H05K7/20509
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Quick Facts
Patent No.
US 10,278,308
App. No.
15/475,159
Granted
Apr 30, 2019
Kind
B2
Abstract

An interlaced heat dissipation structure of an addin card generally includes an addin card, a plurality of heat dissipation fins arranged on the addin card, at least one receiving space defined between the heat dissipation fins, a plurality of cooling pipes extending through the heat dissipation fins, and a plurality of heat dissipative elements arranged in the receiving space in a manner of being interlaced with the cooling pipes. As such, the heat dissipation fins, the cooling pipes, and the heat dissipative elements help cool down the addin card to keep the operation of the addin card stable. The interlaced arrangement of the cooling pipes and the heat dissipative elements in the receiving space defined between the heat dissipation fins makes it possible to maximize the total effective heat dissipation area.

Claims (12)

1. An interlaced heat dissipation structure of an addin card, comprising:

an addin card;

a plurality of heat dissipation fins arranged on the addin card;

at least one receiving space defined between the heat dissipation fins;

a plurality of cooling pipes extending through the heat dissipation fins for cooling the addin card; and

a plurality of heat dissipative elements arranged in the receiving space in a manner of being interlaced with the cooling pipes for cooling the addin card;

wherein the plurality of heat dissipation fins are divided into at least a first group and a second group that are spaced from each other to define the receiving space therebetween such that the first and second groups of heat dissipation fins are located on two sides of the receiving space to dissipate heat from portions of the addin card corresponding to the two sides of the receiving space; and

wherein the cooling pipes each have a portion extending between the first and second groups of heat dissipation fins, and the portions of the cooling pipes and the heat dissipative elements are arranged in an interlaced manner in the receiving space defined between the heat dissipation fins such that the heat dissipative elements are located on two sides of the portion of each of the cooling pipes that is located in the receiving space and extends between the first and second groups of the heat dissipation fins and the portions of the cooling pipes that extend between the first and second groups of the heat dissipation fins are located on two sides of at least a portion of the heat dissipative elements in order to provide additional heat dissipation from a portion of the addin card corresponding to the receiving space, wherein heat is dissipated from different portions of the addin card through the heat dissipation fins and the heat dissipative elements in combination with the cooling pipes.

2. The interlaced heat dissipation structure of the addin card according to claim 1 , wherein the heat dissipation fins are provided with at least one fan positioned thereon.

3. The interlaced heat dissipation structure of the addin card according to claim 1 , wherein the addin card and the heat dissipation fins receive at least one heat conductive board arranged therebetween.

4. The interlaced heat dissipation structure of the addin card according to claim 1 , wherein the cooling pipes, the heat dissipative elements, and the heat dissipation fins are made of metallic materials.

5. The interlaced heat dissipation structure of the addin card according to claim 1 , wherein the addin card comprises a graphics card.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2017
From: HAN, TAI-SHENG
To: EVGA CORPORATION
Reel/Frame 041851/0598 →
Priority Claims (1)
TW 106201025 U · Jan 20, 2017 · national
Continuity (1)
Related Publication 20180213680A1 · Jul 26, 2018
Cited By (1)
US 12,504,796