Patent Assignment
Reel/Frame 041865/0313
Assignment of Assignor's Interest
Recorded: 2017-04-05
Pages: 7
Assignors
KIM, BYUNG HEE
Executed: 2017-03-30
OSZINDA, THOMAS
Executed: 2017-03-13
JUNG, DEOK YOUNG
Executed: 2017-03-06
BAEK, JONG MIN
Executed: 2017-03-06
YIM, TAE JIN
Executed: 2017-03-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having Interconnection Structure