Patent Assignment
Reel/Frame 041988/0485
Assignment of Assignor's Interest
Recorded: 2017-04-13
Pages: 4
Assignors
LIU, ZI-JHENG
Executed: 2017-04-11
KUO, HUNG-JUI
Executed: 2017-04-11
HU, YU-HSIANG
Executed: 2017-04-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method of Fabricating the Same