Patent Assignment
Reel/Frame 041989/0417
Assignment of Assignor's Interest
Recorded: 2017-03-13
Pages: 6
Assignors
LEE, KEOCHANG
Executed: 2017-03-13
PARK, SOOSAN
Executed: 2017-03-13
KIM, KYUNGMOON
Executed: 2017-03-13
LEE, GOO
Executed: 2017-03-13
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Partition Fence and Shielding Layer Around Semiconductor Components
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.