IP Library Assignment 041997/0492
Patent Assignment
Reel/Frame 041997/0492

Assignment of Assignor's Interest

Recorded: 2017-04-13 Pages: 3
Assignor
KRUGER, JAY
Executed: 2017-04-13
Assignee
LITTELFUSE, INC.
8755 WEST HIGGINS ROAD, SUITE 500, CHICAGO, ILLINOIS, 60631
Covered Property (1)
Wire Overmold Device and Method of Forming Wire Overmold Device
Patent: 9,935,449 →
Application: 15/474,013 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 14, 2021
From: HAMLIN ELECTRONICS (SUZHOU) LTD.
To: SUZHOU LITTELFUSE OVS CO., LTD.
Reel/Frame 056851/0283 →