IP Library Granted Patent US 9,935,449
Granted Patent B1
US 9,935,449 · App. 15/474,013 · Granted Apr 3, 2018

Wire overmold device and method of forming wire overmold device

Inventor: Jay Kruger (Chicago, IL)
Assignee: LITTELFUSE, INC.
H02G15/043B60R16/0215H05K5/02
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Quick Facts
Patent No.
US 9,935,449
App. No.
15/474,013
Granted
Apr 3, 2018
Kind
B1
Abstract

A wire overmold device including a carrier body having a distal end and a proximal end, a wire cap configured to engage the distal end of the carrier body, at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body, and an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body, wherein the wire cap and the distal end of the carrier body protrude from the overmold.

Claims (15)

1. A wire overmold device, comprising:

a carrier body having a distal end and a proximal end;

a wire cap configured to engage the distal end of the carrier body;

at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body; and

an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body;

wherein the wire cap and the distal end of the carrier body protrude from the overmold.

2. The wire overmold device according to claim 1 , wherein the carrier body is an elongated semi-cylindrical body having a curved outer surface and a top surface portion.

3. The wire overmold device according to claim 2 , wherein one or more cavities are formed in the top surface portion and extend into the semi-cylindrical body.

4. The wire overmold device according to claim 2 , wherein the wire cap includes a semi-cylindrical body and a top surface portion, the wire cap top surface portion mating with the carrier body top surface portion to enclose the at least one of a jacketed cable and one or more wires.

5. The wire overmold device according to claim 3 , wherein a first cavity formed in the proximal end of the carrier body, the first cavity being configured to receive an electronic component.

6. The wire overmold device according to claim 3 , wherein a second cavity extends from the proximal end of the carrier body, along the semi-cylindrical body, to the distal end of the carrier body, the second cavity being configured to receive a first wire.

7. The wire overmold device according to claim 4 , wherein the wire cap includes a curved outer surface, the curved outer surface having a groove for engaging with the overmold.

8. The wire overmold device according to claim 6 , wherein a third cavity extends from the proximal end of the carrier body, along the semi-cylindrical body, to a distal end of the carrier body, the third cavity being configured to receive a second wire, wherein the second cavity and the third cavity are substantially parallel to each other.

9. The wire overmold device according to claim 1 , wherein the wire cap includes a protrusion, the protrusion being receivable in a corresponding recess in the distal end of the carrier body such that the at least one of the jacketed cable and one or more wires are at least partially enclosed between the wire cap and the distal end of the carrier body.

10. The wire overmold device according to claim 1 , wherein the overmold is formed over a bushing, the bushing being adjacent to the carrier body.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2021
From: HAMLIN ELECTRONICS (SUZHOU) LTD.
To: SUZHOU LITTELFUSE OVS CO., LTD.
Reel/Frame 056851/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2017
From: KRUGER, JAY
To: LITTELFUSE, INC.
Reel/Frame 041997/0492 →