Patent Assignment
Reel/Frame 042022/0617
Assignment of Assignor's Interest
Recorded: 2017-04-15
Pages: 3
Assignor
YAMAUCHI, AKIRA
Executed: 2017-03-31
Assignee
BONDTECH CO., LTD.
77, KISSHOIN-ISHIHARANISHI-MACHI, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8366, JAPAN
Covered Property
(1)
Method for Bonding Substrates Together, and Substrate Bonding Device