Method for bonding substrates together, and substrate bonding device
A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.
1. A method for bonding a first substrate and a second substrate, the method comprising:
a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to a bonding surface of the first substrate and a bonding surface of the second substrate;
a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface;
a step of bowing the second substrate in such a way that a central portion of the bonding surface protrudes toward the first substrate side relative to the outer circumferential portion of the bonding surface;
a first abutting step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions; and
a second abutting step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across an entirety of the bonding surfaces, decreasing a distance between an outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition,
wherein the second abutting step includes:
abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces to bond the first substrate and the second substrate, decreasing the distance between the outer circumferential portion of the first substrate and the outer circumferential portion of the second substrate with distances from bottoms of the first substrate and the second substrate to the respective central portions being maintained.
2. The method according to claim 1 , wherein
the first substrate is bowed by a first protruding mechanism in such a way that the central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface,
the second substrate is bowed by a second protruding mechanism in such a way that the central portion of the bonding surface protrudes toward the first substrate side relative to the outer circumferential portion of the bonding surface, and
one protruding mechanism of the first protruding mechanism and the second protruding mechanism is subjected to a pressure control, while the other of the first protruding mechanism and the second protruding mechanism has a numerically-controlled protruding distance.
3. The method according to claim 2 , wherein a first substrate holder and a second substrate holder are caused to become closer to each other with distances from bottoms of the first substrate and the second substrate to the respective central portions being maintained.
4. The method according to claim 1 , wherein at least the outer circumferential portion of either one or both of the first substrate and the second substrate is held.
5. The method according to claim 1 , wherein the second abutting step includes:
abutting the opposing bonding surfaces of the first substrate and the second substrate with each other, with either one or both of the first substrate and the second substrate being flat.
6. The method according to claim 5 , further comprising:
a step of bonding the first substrate and the second substrate after the second abutting step,
wherein the step of bonding includes pressing the first substrate and the second substrate against each other to bond the first substrate and the second substrate together.
7. The method according to claim 1 , wherein
the second abutting step further includes:
decreasing the distance between the outer circumferential portion of the first substrate and the outer circumferential portion of the second substrate by causing a first substrate holder that holds a first substrate and a second substrate holder that holds a second substrate to become closer to each other.
8. A substrate bonding apparatus comprising:
a first substrate holder that holds a first substrate;
a second substrate holder that holds a second substrate with a bonding surface of the second substrate facing a bonding surface of the first substrate, the first substrate holder being located below the second substrate holder;
hydrophilization treatment means that causes water or an OH containing substance to adhere to the respective bonding surfaces of the first substrate and the second substrate;
a first protruding mechanism that bows the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface;
a second protruding mechanism that bows the second substrate in such a way that a central portion of the bonding surface protrudes toward the first substrate side relative to an outer circumferential portion of the bonding surface; and
a controller, wherein
the controller causes the bonding surface of the bowed first substrate and the bonding surface of the bowed second substrate to abut each other with (i) the first substrate being bowed by the first protruding mechanism in such a way that the central portion protrudes toward the second substrate side relative to the outer circumferential portion of the bonding surface and (ii) the second substrate being bowed by the second protruding mechanism in such a way that the central portion protrudes toward the first substrate side relative to the outer circumferential portion of the bonding surface, and causes the bonding surface of the first substrate and the bonding surface of the second substrate to abut each other across the entirety of the bonding surfaces, decreasing a distance between an outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with (i) distances from bottoms of the first substrate and the second substrate to the respective central portions being maintained and (ii) the respective central portions abutting each other at a pressure that maintains a non-bonded condition.
9. The substrate bonding apparatus according to claim 8 , wherein one protruding mechanism of the first protruding mechanism and the second protruding mechanism is subjected to a pressure control, while the other protruding mechanism is an actuator that has a numerically-controlled protruding distance.
10. The substrate bonding apparatus according to claim 8 , wherein the first substrate holder or the second substrate holder further comprises either one or both of a first substrate holder mechanism that holds the first substrate and a second substrate holder mechanism that holds the second substrate.
11. The substrate bonding apparatus according to claim 10 , wherein the first substrate holder mechanism or the second substrate holder mechanism holds only the outer circumferential portion of the substrate.
12. The substrate bonding apparatus according to claim 10 , wherein the first substrate holder mechanism or the second substrate holder mechanism is an electrostatic chuck.
13. The substrate bonding apparatus according to claim 10 , wherein
the first substrate holder mechanism or the second substrate holder mechanism is a vacuum suction type or an electrostatic chuck, and
a suction groove or an electrostatic chuck of the substrate holder to hold a circumference portion of the first substrate is separate from a suction groove or an electrostatic chuck to hold the central portion of the substrate, and/or a suction groove or an electrostatic chuck of the substrate holder to hold a circumference portion of the second substrate is separate from a suction groove or an electrostatic chuck to hold the central portion of the second substrate.
14. The substrate bonding apparatus according to claim 8 , further comprising an alignment unit that aligns the first substrate and the second substrate,
wherein the alignment unit aligns the first substrate and the second substrate before the bonding surface of the first substrate and the bonding surface of the second substrate abut each other across the entirety of the bonding surfaces to be bonded together.
15. The substrate bonding apparatus according to claim 8 , wherein the first substrate holder further comprises a pressing member that forms a holding surface to hold the first substrate and that is bowed by the protruding mechanism in such a way that a central portion protrudes toward the second substrate side.
16. The substrate bonding apparatus according to claim 8 , further comprising a chamber in which a vacuum is drawn in the atmosphere around the first substrate and around the second substrate.
17. The substrate bonding apparatus according to claim 8 , wherein when the bonding surface of the first substrate and the bonding surface of the second substrate are to abut each other across the entirety of the bonding surfaces, the opposing bonding surfaces of the first substrate and the second substrate abut each other with either one or both of the first substrate and the second substrate being flat.
18. The method according to claim 1 , wherein
the first substrate and the second substrate are caused to be in a planar shape with distances from bottoms of the first substrate and the second substrate to the respective central portions being maintained.
19. The method according to claim 1 , wherein
the first substrate is held by a first substrate holder mechanism,
the second substrate is held by a second substrate holder mechanism, and
the first substrate holder mechanism or the second substrate holder mechanism is an electrostatic chuck.
20. The method according to claim 1 , wherein
the first substrate is held by a first substrate holder mechanism,
the second substrate is held by a second substrate holder mechanism, and
the first substrate holder mechanism or the second substrate holder mechanism is a vacuum suction type or an electrostatic chuck, and
a suction groove or an electrostatic chuck of the substrate holder to hold a circumference portion of the first substrate is separate from a suction groove or an electrostatic chuck to hold the central portion of the substrate, and/or a suction groove or an electrostatic chuck of the substrate holder to hold a circumference portion of the second substrate is separate from a suction groove or an electrostatic chuck to hold the central portion of the second substrate.
21. The substrate bonding apparatus according to claim 8 , wherein a first substrate holder and a second substrate holder are caused to become closer to each other with distances from bottoms of the first substrate and the second substrate to the respective central portions being maintained.
22. The substrate bonding apparatus according to claim 8 , wherein the first substrate and the second substrate are caused to be in a planar shape with distances from bottoms of the first substrate and the second substrate to the respective central portions being maintained.
23. The substrate bonding apparatus according to claim 8 , wherein the controller causes the bonding surface of the bowed first substrate and the bonding surface of the second substrate to abut each other with the first substrate being bowed by the first protruding mechanism in such a way that the central portion protrudes relative to the outer circumferential portion of the bonding surface, and causes the bonding surface of the first substrate and the bonding surface of the second substrate to abut each other across the entirety of the bonding surfaces, decreasing a distance between an outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.